Item# S31HMG01
ADHESIVE, SIKA #31 HI-MOD GEL A & B
Product Description
Sikadur 31, Hi-Mod Gel, is a 2-component, 100% solids, solvent-free, moisture-tolerant, high-modulus, high strength, structural epoxy paste adhesive. It conforms to the current ASTM C-881, Types I and IV, Grade-3, Class-B/C and AASHTO M-235 specifications.
Details
Spec Sheet | View the Spec Sheet for this product |
MSDS | View the MSDS for this product |
Manufacturer | SIKA CORPORATION |
Warranty |