Item# S31HMG01

ADHESIVE, SIKA #31 HI-MOD GEL A & B

Product Description

Sikadur 31, Hi-Mod Gel, is a 2-component, 100% solids, solvent-free, moisture-tolerant, high-modulus, high strength, structural epoxy paste adhesive. It conforms to the current ASTM C-881, Types I and IV, Grade-3, Class-B/C and AASHTO M-235 specifications.

Details
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Manufacturer SIKA CORPORATION
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